IPC-J-STD-001E Requirements for Soldered Elec-trical and Electronic Assemblies
IPC-J-STD-002D Solderability Tests for Compo-nent Leads,Terminations,Lugs,Terminals and Wires
元件引线、端子、焊片、接线柱及导线可焊性试验
IPC-J-STD-003C Solderability Tests for Printed Boards 印制板可焊性试验
IPC-J-STD-004B Requirements for Soldering Flu-xes 软钎焊钎剂要求
IPC-J-STD-005 Requirements for Soldering Pastes 软钎料膏技术要求
IPC-HDBK-005A Guide to Solder Paste Assess-ment 钎料膏性能评价手册
IPC-WP-006 Round Robin Testing and Analysis.Lead-Free Alloys-Tin,Silver,and Copper
无铅钎料合金锡银铜的试验和分析
IPC-J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders 电子设备用电子级软钎焊合金、药芯及实心钎料技术要求
IPC-A-610F Acceptability of Electronic Assem-blies
印制板组装件验收条件(www.xing528.com)
IPC-9701A Performance Test Methods and Qualifi-cation Requirements for Surface Mount Solder Attach-ments 表面组装软钎焊件性能试验方法与鉴定要求
IPC-TR-464 Accelerated Aging for Solderability Evaluations
焊接性加速老化评价
IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments
表面组装软钎焊件加速可靠性试验导则
IPC-SM-780 Component Packaging and Intercon-necting with Emphasis on Surface Mounting
以表面组装为主的元件封装及互连导则
IPC-DRM-PTH-E Through-Hole Solder Evaluation Training and Reference Guide
通孔钎料评估培训和参考指南
接插件焊点评价手册
IPC-DRM-SMT-C Surface Mount Solder Joint Evaluation Desk Reference Manual
表面组装焊点评价手册
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