[1] 刘淑祺,张启运,杨展澜.微量元素在液态Sn表面膜和体相中的分布及其对表面性质的影响[J].金属学报,1986,22(3):A256.
[2] Gerbacia W,Rosano H L.Microemulsions:Formation and stabilization[J].J.Colloid and Interface Science,1973,44:242-248.
[3] Офичерол.А.А.Журн.Прикл.Хим[J].1973,4:764.
[4] Kozakavitch P.Revue de Metallurgie[J].1955,31(7):609.
[5] 兰铁.钎焊时钎料母材界面张力与界面传质关系的研究[D].北京:北京大学化学系,1989.
[6] Zhang Q Y,Lan T,Gao S.The wetting effect and inter-face mass-transfer——How to enhance the wetting be-tween molten filler and base metal[C].Proceedings of the international conference on designing of interface structures in advaced materials and their joints.Osaka Joining and Welding Research Institute of Osaka Univer-sity,High Temperature Society of Japan,2002:496-500.
[7] Bard A J.Electromotive force series of metals in molten salts[J].Encyclopedia of Electrochemistry of Elements,1979:10.
[8] 张启运,刘淑祺,郭海,等.熔盐钎剂对铝氧化膜作用过程的研究[J].金属学报,1985,21(1):B35-B39.
[9] Lugscheider E,庄鸿寿.高温钎焊[M].北京:国防工业出版社,1989:150.
[10] 张启运,刘淑祺,刘东起,等.微量添加元素对熔态Sn-Pb共晶合金抗氧化能力的影响[J].金属学报,1984,20(4):A296-A302.
[11] ПетрунинаИЕ.Справочникпопайке[M].Москва:Машиностроение,1984:105.
[12] 邱竹贤.铝冶金物理化学[M].上海:上海科学技术出版社,1985:26.
[13] Field D J,Steward N I.Mechanistic aspect of the No-colok flux brazing process[J].Soc Autom Eng,1988:1656.
[14] Massalski T B.Binary alloy phase diagrams[M].Met-al Park,Ohio,Amer Soc Met,1986.
[15] Lison R.Metal[J],1979,33(6):843.
[16] 庄鸿寿,Lugscheider E.不锈钢真空钎焊时的脱氧和润湿机理[J].焊接学报,1982,3(4):139.
[17] Terrill J R,Cochran G N,Stokes J J,et al.Under-stading the mechanisms of aluminum brazing[J].WeldJ,1971,51(12):833.
[18] Winterbottom W L,Gilmour G A.Vacuum brazing of aluminum:Auger studies of wetting and flow character-istics[J].J Vac Sct Technol,1976,13(2):634.
[19] 劳邦盛,高苏,张启运.固液金属界面上金属间化合物的非平衡生长[J].物理化学学报,2001,17(5):453.
[20] 张启运.无铅钎焊的困惑、出路和前景[J].焊接,2007(2):6-10.
[21] 任峰,张启运.Cu-Sn界面上金属间化合物生长的抑制[J].金属学报,2002,38(7):727-730.(www.xing528.com)
[22] 张启运,刘淑祺,许亚平.Cu与液态Sn的相互作用(Ⅱ)—金属间化合物生长的SEM观察[J].金属学报,1992,28(9):B379-B383.
[23] Rabinkin A,Amorphous Brazing Foil at Age of Maturi-ty[C].Proceedings of the 3rd international Brazing and Soldering Conference,San Antonio,Texas,USA,2006:148-156,American Welding Society.
[24] 俞伟元.非晶态钎料的钎焊性能及其连接机理[D].兰州:兰州理工大学,2009.
[25] 张启运,刘淑祺.关于钎焊冶金过程的一个问题——愿与陈根宝教授等商榷[J].金属学报,1984,20(3):B174-176.
[26] Hausner S,Weis S,Wielage B,et al.Joining of Cop-per at Low Temperatures Using Ag Nanoparticles[C].Proceedings of the International Brazing&Soldering Conference(IBSC),2015,Long Beach,USA.
[27] Park,S.H,et al.Electrical properties of silver paste prepared from nanoparticles and lead-free frit[J].Journal of Nanoscience and Nanotechnology,2007,7:3917-3919.
[28] 川勝一郎.ろう接工学[M].束京:朝倉晝店,1972:69.
[29] Kim H K,Tu K N.Kinetic analysis of the soldering reaction between eutectic Sn-Pb alloy and Cu accompa-nied by ripening[J].Physical Review B,1996,53(23):16027.
[30] Morey G W,Merwin H E.System Na2O·B2O3-B2O3[J].J.Amer.Chem.Soc,1936,58:2252.
[31] 中国机械工程学会焊接学会.焊接手册:第1卷 焊接方法及设备[M].北京:机械工业出版社,1994.
[32] 美国金属学会.金属手册:第6卷 焊接、硬钎焊、软钎焊[M].9版.包芳涵,等译.北京:机械工业出版社,1994.
[33] Suzuki K.Internation DCT/JP85/00705,WO86/04007[P].1986.
[34] 薛松柏.焊接手册[M].3版.北京:机械工业出版社,2008:577-606.
[35] 邹僖.钎焊[M].修订版.北京:机械工业出版社,1989:74.
[36] 高橋進.アルミニウムのろう接たおける制御雰囲気とフテツクスの共存[J].熱処理,1987,27(3):170.
[37] Muckett S J,Thwaites C T.Vapour phase soldering-A versatile technique[J].Met.Constr,1985(3).
[38] 田中和吉.电子产品焊接技术[M].孟令国,黄琴香,译.北京:电子工业出版社,1984.
[39] 张启运,刘淑祺.高温铝钎料的选择及其与母材的相互作用[J].金属学报,1981,17(3):300-306.
[1]1Cr18Ni9Ti虽为淘汰产品,但在我国许多领域仍然使用着,为此本书保留了与1Cr18Ni9Ti相关的内容。
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